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Nanoindentation Educational e-Seminar | February 22

Instrumented Indentation - Session 8: Nanoindentation of Thin Films

A new e-seminar series from Nanomechanics

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Session 8: Nanoindentation of Thin Films

Wednesday, February 22, 2017

12:00pm, Eastern Time

Abstract:
Substrate influence is a common problem when using nanoindentation to evaluate the elastic modulus of thin films. In this session, an elastic model for film-substrate interaction is presented which returns accurate film moduli even when substrate influence is substantial. The new model is applied to the interpretation of nanoindentation data on various thin films, including low-k films on silicon.

Who Should Attend and Why?
Anyone responsible for or interested in nanoindentation should attend to quickly gain a comprehensive understanding of the test method and what it can do. Process engineers, test engineers and graduate students will achieve theoretical and practical knowledge about contact mechanics, the Oliver-Pharr method, dynamic indentation, thin-film modeling, and best practice.

 

Click here to register

 

About the series
Instrumented indentation, also called nanoindentation, has developed over the last three decades as the technique of choice for measuring the mechanical properties of thin films and other small volumes of material.  This instructional e-seminar, held monthly, covers all aspects of instrumented indentation, from overarching concepts to practical aspects of implementation. 

The first session explains why materials behave differently at the nanoscale, and provides an elementary introduction to instrumented indentation and its benefits.  Subsequent sessions teach contact mechanics, the Oliver – Pharr method, dynamic indentation, and thin-film modeling.  Theory is applied to a variety of common applications for instrumented indentation, including low-k films, hard coatings, polymers, and small structures.  Attendees are invited to suggest topics for future sessions.

Presenter Information:
Jennifer Hay is a senior applications engineer with Nanomechanics, Inc., a company which designs and produces advanced nano-scale metrology products, including turnkey nano-indenters, modular devices for nano-scale actuation and sensing, and contract testing. Mrs. Hay holds a masters’ degree in Mechanical Engineering from the University of Houston and has worked in the field of nano-indentation since 1996, advancing standardization while also developing methodology for new applications including thin films, anelastic metals, polymers, gels, and biomaterials. Mrs. Hay presently serves as the vice-chair for the MEMS/Nanomechanics technical division of the Society of Experimental Mechanics. In addition to many journal articles and conference papers, she has authored five invited journal articles on the theory and practice of instrumented indentation.